Step 1- Class Select Form:
 Online Registration Opens Until August 31


SEMICON Taiwan 2014 Programs:

    Date & Time  Program Name Venue Price/NTD
2017/9/13--09:00 - 16:45 Advanced Packaging Technology Symposium
先進封裝技術論壇 
Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
 
4000 
2017/9/13--08:30 - 12:30 Market Trends Forum
半導體市場趨勢論壇 
402ab
 
2000 
2017/9/13--08:30 - 16:25 MEMS & Sensors Forum
MEMS & Sensors論壇 
Grande Luxe Banquet Luxury Ballroom / 中信企業總部三樓雅悅會館寶儷廳
 
2500 
2017/9/13--10:00 - 17:10 Semiconductor Materials Forum
半導體材料技術論壇 
Grande Luxe Banquet Splendor Ballroom / 中信企業總部三樓雅悅會館翡儷廳
 
3000 
2017/9/13--12:40 - 17:00 Smart Manufacturing Forum
半導體智慧製造論壇 
402ab
 
2500 
2017/9/13--13:00 - 16:50 Executive Summit -Grand Opening Keynote Session
科技菁英領袖高峰論壇 
401
 
Free 
2017/9/13--12:50 - 17:00 Sustainable Manufacturing Forum
高科技產業永續發展論壇 
402c
 
Free 
2017/9/13--13:00 - 17:00 Sustainable Supply Management Forum
半導體永續供應管理論壇 
505
 
Free 
2017/9/13--13:30 - 17:00 ITC-Asia  504abc
 
31200 
2017/9/13--08:30 - 12:00 Advanced Packaging Tutorials - Bumping Technology
先進封裝教程 - 金屬凸塊技術 
614
 
2500 
2017/9/14--08:20 - 17:00 SiP Global Summit 2017- 3D Technology Forum
系統級封測國際高峰論壇 2017 - 3D 技術趨勢論壇 
Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
 
5000 
2017/9/14--08:30 - 17:20 High-Tech Facility International Forum
高科技廠房設施國際論壇 
402ab
 
4000 
2017/9/14--18:00 - 21:00 High-Tech Facility VIP Banquet
高科技廠房設施VIP晚宴 
"My Humble House", 3F, Nangkang Exhibition Hall / 南港展覽館1館3樓寒舍樂樂軒
 
3990 
2017/9/14--08:30 - 17:05 Power and Compound Semiconductors Technology Forum
功率暨化合物半導體論壇 
401
 
4000 
2017/9/14--09:00 - 12:00 CFO and Investor Summit
財務長及投資人高峰論壇 
402c
 
Free 
2017/9/14--08:30 - 12:00 Cross-Straits Integrated Circuit Cooperation Seminar
海峽兩岸合作研討會 
404
 
Free 
2017/9/14--13:00 - 16:15 Laser Technologies in Advanced Packaging Process
先進封裝製程雷射技術發表 
402c
 
Free 
2017/9/14--13:30 - 17:00 The Next Wave on AI + IOT -
Opportunities and Challenges in Semiconductor
AI + IOT未來應用發展論壇 - 對半導體產業的挑戰與機遇 
404
 
Free 
2017/9/14--08:30 - 17:00 ITC-Asia  504abc
 
31200 
2017/9/14--08:30 - 12:30 Advanced Packaging Tutorials - Dicing & Attach Technology
先進封裝教程 - 前段封裝技術 
614
 
2500 
2017/9/15--08:30 - 16:55 SiP Global Summit 2017- Embedded and Fan Out Package Technology Forum
系統級封測國際高峰論壇 2017- 內嵌與扇出封裝技術論壇 
Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
 
5000 
2017/9/15--09:00 - 16:25 IC Forum
半導體先進製程科技論壇 
401
 
3500 
2017/9/15--08:30 - 11:40 Smart Automotive Forum
智慧汽車設計論壇 
402ab
 
2500 
2017/9/15--09:30 - 17:00 Circular Economy Forum
循環經濟論壇 
505
 
Free 
2017/9/15--13:00 - 16:30 Smart MedTech Forum
智慧醫療科技論壇 
505
 
2500 
2017/9/15--08:30 - 17:00 ITC-Asia  504abc
 
31200 
2017/9/15--08:30 - 12:00 Advanced Packaging Tutorials - Encapsulation Technology
先進封裝教程 - 後段封裝技術 
614
 
2500 


Forum Pricing List:

Forum Price & Member Types Original & On-Site Price
/原價以及現場價
early bird price
/早鳥優惠價格:
(Until 8/18)
Group Price-3 people above
團體報名(三人以上)
(即日起至8/28)
Market Trends Forum
(Code 1)
非會員
Non-Member
US$110/
NT$2,600
US$75/
NT$1,600
US$75/ per person
NT$1,600 /每人
會員
SEMI Member
US$90/
NT$2,100
200mm Manufacturing Forum
(Code 4)
非會員
Non-Member
US$110/
NT$2,600
US$75/
NT$1,600
US$75/ per person
NT$1,600 /每人
會員
SEMI Member
US$90/
NT$2,100
Advanced Packaging
Technology Symposium
(Code 7)
非會員
Non-Member
US$135/
NT$3,300
US$90/
NT$2,100
US$90/ per person
NT$2,100 /每人
會員
SEMI Member
US$110/
NT$2,600
High-Tech Facility
International Forum
(Code 12)
非會員
Non-Member
US$117/
NT$3,500
US$117/
NT$3,500
US$117/ per person
NT$3,500 /每人
會員
SEMI Member
US$100/
NT$3,000
US$100/
NT$3,000
US$100/ per person
NT$3,000 /每人
Litho/Mask Technology
Symposium
(Code 17)
非會員
Non-Member
US$135/
NT$3,300
US$90/
NT$2,100
US$90/ per person
NT$2,100 /每人
會員
SEMI Member
US$110/
NT$2,600
SiP Global Summit 2014
(Code 20)
非會員
Non-Member
US$245/
NT$6600
US$150/
NT$3,700
US$150/ per person
NT$3,700 /每人
會員
SEMI Member
US$205/
NT$5100

*Price is not included with 5% tax / 以上價格未含5%稅
*On-Line Registration opens until Aug. 31st /線上報名開放至8月31日止

*Need to complete payment before Aug 18th to enjoy special price
/請於8/18日前完成繳費以享有優惠價格

★ Cancellation Policy Cancellation before Aug 9th, 90% Refund (not including administration fee). Cancellation during Aug 10th to Aug 20th, 50% Refund (not including Administration fee). NO REFUND after Aug 20th.
★ 退費相關事宜 完成繳費後,若於8/9日前取消,可退報名費90%(手續費自行負擔) ; 8/10日至8/20日取消可退報名費50%(手續費自行負擔),8/20日後取消,恕不退費,敬請見諒。

Lunch Box Order:
 2014/09/04  Lunch Box Order Service/訂購便當服務
Regular / 葷
Vegetarian / 素
 2014/9/5  Lunch Box Order Service/訂購便當服務
Regular / 葷
Vegetarian / 素
 2014/9/6  Lunch Box Order Service/訂購便當服務
Regular / 葷
Vegetarian / 素
(Lunch Box Price/便當費用: NT240)未稅
*Lunch box order and paid service open until Aug. 20 18:00. If you do not complete your payment before the deadline, the service will be canceled. 便當代訂服務及繳費至8月20日下午六點截止,未完成付費者即自動取消。
You are: Non-SEMI Member / 非SEMI會員
SEMI Member / SEMI會員(輸入統編) 
SEMI Member / SEMI會員      
IEEE Member / IEEE會員(輸入編號) 
Student / 學生
參加論壇注意事項::
1. 入場方式:
 a.SEMICON Taiwan 2014 論壇:
  將憑SEMICON Taiwan 2014識別證及一張個人名片入場。
 b.SiP Global Summit 2014 (3D IC and Embedded Technology Forum)
  - 將憑 SiP Global Summit 2014 識別證及一張個人名片入場。
2. 領取識別證方式:
 a.8月9日前 完成線上報名並繳費完成之國內報名者, 我們將郵寄SEMICON Taiwan 2014 / SiP Global Summit 2014識別證到您提供之國內郵寄地。
8月10日(含)以後及國外報名者, 請一律於9/3-9/5至南港展覽館4樓M區門口Program Registration Counter憑“Signup ID”領取參觀者識別證。
 b.僅參加SiP Global Summit 2014 論壇者可於9/4-9/5至南港展覽館5樓504會議室門口領取識別證。
3. 所有論壇之簡報將在論壇後二星期內於SEMICON Taiwan 2014網站開放PDF格式下載, 惟提供下載之簡報須取得講師同意後方能提供。請上網填寫問卷後下載, 論壇現場將不會發放任何紙本講義。
4. 因座位有限,請於課程開始前三十分鐘報到。座位採先到先入席制, 請提早到場避免向隅。
 

Remarks:
1. Admission:
 a. SEMICON Taiwan 2014 Programs:
  -Please prepare the SEMICON Taiwan 2014 badge plus your business card as the admission.
 b.SiP Global Summit 2014 (3D IC and Embedded Technology Forum):
   -Please prepare the SiP Global Summit 2014 badge plus your business card as the admission.
2. Badges will be ready as following:
 a.We will mail SEMICON Taiwan 2014 / SiP Global Summit 2014 Badge to your mailing address in Taiwan if you complete registration process with payment by 9th August , yet if you do not have mailing address in Taiwan please pick up your SEMICON Taiwan 2014 / SiP Global Summit 2014 badge with your “Signup ID” in Program Registration Counter located at 4F, TWTC Nangang Exhibition Hall.
 b.Please pick up your SiP Global Summit 2014 badge if you only register this summit at On-site Registration Counter located at Rm. 504, 5F, TWTC Nangang Exhibition Hall, during Sep 4th to 5th.
3. There will have NO hard copy proceedings for the programs but on-line download instead. The downloadable PDF (with speakers’ authorization) will be opened within 2 weeks after Sep 5th. You will need to fill out the on-line survey in order to download the presentation.
4. Registration is on a first-come-first-served basis so please arrive 30 minutes earlier before the program starts. Seats are limited.
 


* 欲修改您的個人報名訊息,請聯絡
If you would like to revise your registration information, please contact:
Leadexpo / Mr. Jay Huang
集利科技 黃先生
電話/Tel:02-2729-9271
E-mail:jay@leadexpo.com

若有任何論壇相關問題
Please contact Ms. Diane Chang of SEMI Taiwan if have any questions about forums
請聯絡

SEMI Taiwan
黃小姐 / Please contact SEMI Taiwan, Ms. Jenny Huang
電話/Tel:03-560-1777 ext 505
傳真/Fax:03-560-1555
E-mail: jhuang@leadexpo.com


SEMI Taiwan
姚小姐 / Please contact SEMI Taiwan, Ms. Susan Yao
電話/Tel:03-560-1777 ext 501
傳真/Fax:03-560-1555
E-mail: syao@semi.org